Semiconductor Market: 3D IC and 2.5D IC Market Research Report, Technological Improvements, Product Quality and During 2019

Posted on 2019-02-19 by Mark Hub in Semiconductors // 0 Comments

Albany, USTSMC (Taiwan), Samsung (South Korea), Toshiba (Japan), ASE Group (Taiwan), Amkor (U.S.), UMC (Taiwan), 3D IC and 2.5D IC Market, 2019-Feb-19 — /EPR Network/ —An up-to-date research report has been disclosed by Market Research Hub highlighting the title “Global 3D IC and 2.5D IC” Market Research Report 2019 which provides an outlook for current market value as well as the expected growth of 3D IC and 2.5D IC during 2018-2025. The report studies the casing heads market worldwide, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, size, growth, revenue, consumption, import and export in these regions.

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In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

The global 3D IC and 2.5D IC market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D IC and 2.5D IC volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC and 2.5D IC market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)

Segment by Regions
North America
Europe
China
Japan

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Table of Contents

Executive Summary
1 3D IC and 2.5D IC Market Overview
1.1 Product Overview and Scope of 3D IC and 2.5D IC
1.2 3D IC and 2.5D IC Segment by Type
1.2.1 Global 3D IC and 2.5D IC Production Growth Rate Comparison by Type (2014-2025)
1.2.2 3D wafer-level chip-scale packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Segment by Application
1.3.1 3D IC and 2.5D IC Consumption Comparison by Application (2014-2025)
1.3.2 Consumer electronics
1.3.3 Telecommunication
1.3.4 Industry sector
1.3.5 Automotive
1.3.6 Military and Aerospace
1.3.7 Smart technologies
1.3.8 Medical devices
1.3 Global 3D IC and 2.5D IC Market by Region
1.3.1 Global 3D IC and 2.5D IC Market Size Region
1.3.2 North America Status and Prospect (2014-2025)
1.3.3 Europe Status and Prospect (2014-2025)
1.3.4 China Status and Prospect (2014-2025)
1.3.5 Japan Status and Prospect (2014-2025)
1.3.6 Southeast Asia Status and Prospect (2014-2025)
1.3.7 India Status and Prospect (2014-2025)
1.4 Global 3D IC and 2.5D IC Market Size
1.4.1 Global 3D IC and 2.5D IC Revenue (2014-2025)
1.4.2 Global 3D IC and 2.5D IC Production (2014-2025)

2 Global 3D IC and 2.5D IC Market Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Production Market Share by Manufacturers (2014-2019)
2.2 Global 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
2.3 Global 3D IC and 2.5D IC Average Price by Manufacturers (2014-2019)
2.4 Manufacturers 3D IC and 2.5D IC Production Sites, Area Served, Product Types
2.5 3D IC and 2.5D IC Market Competitive Situation and Trends
2.5.1 3D IC and 2.5D IC Market Concentration Rate
2.5.2 3D IC and 2.5D IC Market Share of Top 3 and Top 5 Manufacturers
2.5.3 Mergers & Acquisitions, Expansion

3 Global 3D IC and 2.5D IC Production Market Share by Regions
3.1 Global 3D IC and 2.5D IC Production Market Share by Regions
3.2 Global 3D IC and 2.5D IC Revenue Market Share by Regions (2014-2019)
3.3 Global 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
3.4 North America 3D IC and 2.5D IC Production
3.4.1 North America 3D IC and 2.5D IC Production Growth Rate (2014-2019)
3.4.2 North America 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
3.5 Europe 3D IC and 2.5D IC Production
3.5.1 Europe 3D IC and 2.5D IC Production Growth Rate (2014-2019)
3.5.2 Europe 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
3.6 China 3D IC and 2.5D IC Production (2014-2019)
3.6.1 China 3D IC and 2.5D IC Production Growth Rate (2014-2019)
3.6.2 China 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)
3.7 Japan 3D IC and 2.5D IC Production (2014-2019)
3.7.1 Japan 3D IC and 2.5D IC Production Growth Rate (2014-2019)
3.7.2 Japan 3D IC and 2.5D IC Production, Revenue, Price and Gross Margin (2014-2019)

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