Chip Scale Package (CSP) Gains Traction in LED Industry Landscape

Posted on 2019-02-08 by Mark Hub in Semiconductors, Technology // 0 Comments

ALBANY, US, 2019-Feb-08 — /EPR Network/ —

Chip scale package (CSP) LEDs had not been prevalently used in the mainstream LED lighting markets on the back drop of comparatively lower efficacy levels against conventional LED packages. At the time when market players look to propel its competitive edge in chip scale technology, Samsung electronics’ upgraded efficacy-leading fillet-enhanced chip-scale has been widely used in the mainstream LED lighting markets, including down light, high bay, street lighting and canopy applications. The combination of sophisticated packaging technologies and cost reduction such as chip scale package and fillip chip has been changing the landscape of LED industry. Empowering the lighting manufacturers with range of luminaire designs with tremendous reliability, performance and cost benefits, chip scale package (CSP) LEDs continue to gain traction.

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These aforementioned excerpts are in line with the report titled, “Chip Scale Package (CSP) LED Market—Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2018-2026,” which has been lately incorporated in the ever expanding repository of Market Research Reports Search Engine (MRRSE).

Chip scale packages (CSPs) are new to the LED industry, however, they are the mainstay in the semiconductor industry. Chip scale packages enable a plunge in the device parasitic and leverages integration into level 2 packaging such as module packaging. Inevitably as a natural evolution, the CSPs have proliferated into LED industry, and is being hugely popular. Given it offers better thermal contact to substrate, provides miniaturized size, the market for chip scale package is expected grow.

The report propounds a comprehensive analysis on the market for chip scale package (CSP) LEDs for the assessment period. In addition, the report delves into drivers, trends, restraints and opportunities having significant impact in the growth of chip scale package (CSP) LEDs market. The segregation of the market elucidating a holistic view of the market for chip scale package (CSP) LEDs includes application, end-user, power range and geography.

The report starts with the executive summary followed by market overview section. The market overview section includes PESTLE analysis and value chain analysis. In addition, the report also delves into the Porters’ Five Force Analysis which exhaustively analyzes the competitive landscape in the chip scale package (CSP) LEDs market.

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The final section of the market for chip scale package (CSP) LEDs incorporates competitive landscape with a competition dashboard, competition deep dive, developments such as mergers, acquisitions and expansion, benchmarking, and competition deep dive. The section elucidates company overview, financial overview, key differentiators, SWOT analysis, recent development, strategies and product portfolio. A few of the companies analyzed in the exhaustive report are Genesis Photonics Inc., LG Innotek, Samsung Electronics Co. Ltd, Seoul Semiconductor CO Ltd., and Lumileds Holding B.V., among others.

Insights and intelligence provided on the market for chip scale package (CSP) LEDs are underpinned by a rigorous research methodology incorporating comprehensive secondary and primary researches. Primary interview have helped gain authentic and unbiased first-hand information on the chip scale package (CSP) LEDs market, while insights obtained by secondary research has been validated using those gained assessments from primary interviews.

The market size has been considered after analyzing range of functional aspects. Besides, the report focuses on the quantitative assessment such as market share by nature, region, distribution channel, end-user along with qualitative inputs through primary resources. This report can serve as a credible source of information for readers to make effective and triumphant business decisions.

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