Key Opportunities and Challenges in the Die Bonder Equipment Market

Northbrook, USA, 2019-Dec-03 — /EPR Network/ —

The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024; it is expected to grow at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.

Die bonding is a process of attaching a substrate or a chip to the die pad of the semiconductor package. Die bonding equipment play a key role in the assembly of semiconductor devices during the fabrication process. Companies operating in this market offer 3 types of die bonders: manual, semiautomatic, and fully automatic. Semiconductor packaging can be done by using different bonding techniques, such as epoxy, eutectic, soft solder, thermocosmpression, ultrasonic, and thermosonic. Die bonder equipment are used to fabricate devices such as optoelectronics, MEMS and MOEMS, and power devices. These devices find applications in sectors including consumer electronics, industrial, automotive, telecommunications, healthcare, and aerospace & defense.

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In 2018, the IDM firms segment captured the largest share in the die bonder equipment market. Most of the tier 1 IDM companies such as Samsung (South Korea), Texas Instruments (US), Sony Corporation (Japan), and STMicroelectronics (Switzerland) have significant presence across the world, with a huge customer base. IDMs use die bonder equipment enabled with advanced bonding techniques for the assembly process of complicated semiconductor equipment with high accuracy, driving the growth of the market. Also, the dominance of IMDs is expected to remain constant in the near future due to the increasing number of semiconductor fabrication plants all over the world.

Among bonding techniques, epoxy bonding techniques are expected to witness the highest CAGR in the die bonder equipment market during the forecast period. The growth of the die bonder equipment market for this technique is attributed to the adoption of the epoxy bonding technique for the assembly process of products such as optoelectronics, micro-electro-mechanical systems (MEMS), micro-opto-electro-mechanical systems (MOEMS), and power devices. Lesser complexity and lower operating/curing temperature compared to other bonding techniques make this bonding technique suitable for the assembly of semiconductor components on a large scale. Also, the availability of a wide range of adhesive materials and epoxy films required for bonding accelerates the adoption of the epoxy bonding method.

Among applications, the automotive segment is expected to grow at the highest CAGR during the forecast period. The growth of this segment can be attributed to the implementation of technologically advanced die bonding equipment for the assembly of advanced vehicle electronics is expected to propel the growth of the die bonder equipment market in the near future.

The die bonder equipment industry in APAC is projected to grow at the highest CAGR from 2019 to 2024. The commanding position of APAC is due to the presence of a large number of OSAT companies in the region. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan is also expected to accelerate the market growth in APAC.

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