Global Ball Grid Array (BGA) Package Market Size, Industry Status, Growth opportunity, key-Players Future and Forecast Until 2025

Posted on 2018-10-09 by Mark Hub in Software // 0 Comments

Albany, US, 2018-Oct-09 — /EPR Network/ —This research report titled “Global Ball Grid Array (BGA) Package Market” Size, Status and Forecast 2018-2025 has been added to the wide online database managed by Market Research Hub (MRH). The study discusses the prime market growth factors along with future projections expected to impact the Ball Grid Array (BGA) Package Market during the period between 2018 and 2025. The concerned sector is analyzed based on different market factors including drivers, restraints and opportunities in order to enlighten the readers about the actual scenario prevailing in the Ball Grid Array (BGA) Package Market.

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A Ball Grid Array or BGA package is a form of surface mount technology, or SMT package that is being used increasingly for integrated circuits.. The Ball Grid Array, BGA, uses a different approach to the connections to that used for more conventional surface mount connections. Other packages such as the quad flat pack, QFP, used the sides of the package for the connections. This meant that there was limited space for the pins which had to be spaced very closely and made much smaller to provide the required level of connectivity. The Ball Grid Array, BGA, uses the underside of the package, where there is a considerable area for the connections.
The Ball Grid Array, BGA package was developed out of the need to have a more robust and convenient package for integrated circuits with large numbers of pins. With the levels of integration rising, some integrated circuits had in excess of 100 pins.
In 2017, the global Ball Grid Array (BGA) Package market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2018-2025.
This report focuses on the global Ball Grid Array (BGA) Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Ball Grid Array (BGA) Package development in United States, Europe and China.

The key players covered in this study
Intel
NexLogic Technologies
Texas Instruments
Palomar Technologies
Micro Systems Technologies
Sonix
Advanced Interconnections Corp
…

Market segment by Type, the product can be split into
Common BGA package
Flip Chip BGA Package

Market segment by Application, split into
PCBs
Other

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

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Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global Ball Grid Array (BGA) Package Market Size Growth Rate by Type (2013-2025)
1.4.2 Common BGA package
1.4.3 Flip Chip BGA Package
1.5 Market by Application
1.5.1 Global Ball Grid Array (BGA) Package Market Share by Application (2013-2025)
1.5.2 PCBs
1.5.3 Other
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 Ball Grid Array (BGA) Package Market Size
2.2 Ball Grid Array (BGA) Package Growth Trends by Regions
2.2.1 Ball Grid Array (BGA) Package Market Size by Regions (2013-2025)
2.2.2 Ball Grid Array (BGA) Package Market Share by Regions (2013-2018)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities

3 Market Share by Key Players
3.1 Ball Grid Array (BGA) Package Market Size by Manufacturers
3.1.1 Global Ball Grid Array (BGA) Package Revenue by Manufacturers (2013-2018)
3.1.2 Global Ball Grid Array (BGA) Package Revenue Market Share by Manufacturers (2013-2018)
3.1.3 Global Ball Grid Array (BGA) Package Market Concentration Ratio (CR5 and HHI)
3.2 Ball Grid Array (BGA) Package Key Players Head office and Area Served
3.3 Key Players Ball Grid Array (BGA) Package Product/Solution/Service
3.4 Date of Enter into Ball Grid Array (BGA) Package Market
3.5 Mergers & Acquisitions, Expansion Plans

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