Global IC Packaging Market Expected to Recover during the Forecast Period until 2025

Posted on 2018-10-26 by Mark Hub in Industrial, Semiconductors // 0 Comments

Albany, US, 2018-Oct-26 — /EPR Network/ —This research report titled “Global IC Packaging Market Insights, Forecast to 2025” has been added to the wide online database managed by Market Research Hub (MRH). The study discusses the prime market growth factors along with future projections expected to impact the IC Packaging market during the period between 2018 and 2025. The concerned sector is analyzed based on different market factors including drivers, restraints and opportunities in order to enlighten the readers about the actual scenario prevailing in the IC Packaging market”.

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This report presents the worldwide IC Packaging market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This industry is affected by the economy and policy, so its important to put an eye to economic indexes and leaders prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
The IC Packaging market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for IC Packaging.

The following manufacturers are covered in this report:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond

IC Packaging Breakdown Data by Type
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
IC Packaging Breakdown Data by Application
CIS
MEMS
Others

IC Packaging Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

IC Packaging Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global IC Packaging status and future forecastinvolving, production, revenue, consumption, historical and forecast.
To present the key IC Packaging manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of IC Packaging :
History Year: 2013 – 2017
Base Year: 2017
Estimated Year: 2018
Forecast Year: 2018 – 2025

This report includes the estimation of market size for value (million USD) and volume (K Pcs). Both top-down and bottom-up approaches have been used to estimate and validate the market size of IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

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Table of Contents

1 Study Coverage
1.1 IC Packaging Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
1.4.1 Global IC Packaging Market Size Growth Rate by Type
1.4.2 DIP
1.4.3 SOP
1.4.4 QFP
1.4.5 QFN
1.4.6 BGA
1.4.7 CSP
1.4.8 LGA
1.4.9 WLP
1.4.10 FC
1.4.11 Others
1.5 Market by Application
1.5.1 Global IC Packaging Market Size Growth Rate by Application
1.5.2 CIS
1.5.3 MEMS
1.5.4 Others
1.6 Study Objectives
1.7 Years Considered

2 Executive Summary
2.1 Global IC Packaging Market Size
2.1.1 Global IC Packaging Revenue 2013-2025
2.1.2 Global IC Packaging Production 2013-2025
2.2 IC Packaging Growth Rate (CAGR) 2018-2025
2.3 Analysis of Competitive Landscape
2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
2.3.2 Key IC Packaging Manufacturers
2.3.2.1 IC Packaging Manufacturing Base Distribution, Headquarters
2.3.2.2 Manufacturers IC Packaging Product Offered
2.3.2.3 Date of Manufacturers Enter into IC Packaging Market
2.4 Key Trends for IC Packaging Markets & Products

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