Global 3D IC and 2.5D IC Market Insights, Applications, Technological Improvements, Future Expectations and Forecast to 2025

Posted on 2019-05-01 by Mark Hub in Semiconductors // 0 Comments

Market Research Hub (MRH) has actively included a new research study titled “Global 3D IC and 2.5D IC Market” Insights, Forecast to 2025 to its wide online repository. The concerned market is discoursed based on a variety of market influential factors such as drivers, opportunities and restraints. This study tends to inform the readers about the current as well as future market scenarios extending up to the period until forecast period limit; 2025. In addition, a deep analysis of the competitive landscape, including prime market players is also enclosed in this report.

Get Sample Copy of This Report @ https://www.marketresearchhub.com/enquiry.php?type=S&repid=2288240

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period

In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

The 3D IC and 2.5D IC market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC and 2.5D IC.

This report presents the worldwide 3D IC and 2.5D IC market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

The following manufacturers are covered in this report:
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)

3D IC and 2.5D IC Breakdown Data by Type
3D wafer-level chip-scale packaging
3D TSV
2.5D
3D IC and 2.5D IC Breakdown Data by Application
Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices

3D IC and 2.5D IC Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

3D IC and 2.5D IC Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

BROWSE Full Report NOW @ https://www.marketresearchhub.com/report/global-3d-ic-and-25d-ic-market-insights-forecast-to-2025-report.html

Table of Contents

1 Study Coverage
1.1 3D IC and 2.5D IC Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
1.4.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type
1.4.2 3D wafer-level chip-scale packaging
1.4.3 3D TSV
1.4.4 2.5D
1.5 Market by Application
1.5.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Application
1.5.2 Consumer electronics
1.5.3 Telecommunication
1.5.4 Industry sector
1.5.5 Automotive
1.5.6 Military and Aerospace
1.5.7 Smart technologies
1.5.8 Medical devices
1.6 Study Objectives
1.7 Years Considered

2 Executive Summary
2.1 Global 3D IC and 2.5D IC Market Size
2.1.1 Global 3D IC and 2.5D IC Revenue 2014-2025
2.1.2 Global 3D IC and 2.5D IC Production 2014-2025
2.2 3D IC and 2.5D IC Growth Rate (CAGR) 2019-2025
2.3 Analysis of Competitive Landscape
2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
2.3.2 Key 3D IC and 2.5D IC Manufacturers
2.3.2.1 3D IC and 2.5D IC Manufacturing Base Distribution, Headquarters
2.3.2.2 Manufacturers 3D IC and 2.5D IC Product Offered
2.3.2.3 Date of Manufacturers Enter into 3D IC and 2.5D IC Market
2.4 Key Trends for 3D IC and 2.5D IC Markets & Products

3 Market Size by Manufacturers
3.1 3D IC and 2.5D IC Production by Manufacturers
3.1.1 3D IC and 2.5D IC Production by Manufacturers
3.1.2 3D IC and 2.5D IC Production Market Share by Manufacturers
3.2 3D IC and 2.5D IC Revenue by Manufacturers
3.2.1 3D IC and 2.5D IC Revenue by Manufacturers (2014-2019)
3.2.2 3D IC and 2.5D IC Revenue Share by Manufacturers (2014-2019)
3.3 3D IC and 2.5D IC Price by Manufacturers
3.4 Mergers & Acquisitions, Expansion Plans

More Information………@@@

Enquire about this Report @ https://www.marketresearchhub.com/enquiry.php?type=enquiry&repid=2288240

About Market Research Hub

Market Research Hub (MRH) is a next-generation reseller of research reports of different sector like semiconductor market research and analysis. MRH’s expansive collection of industry reports has been carefully curated to help key personnel and decision makers across industry verticals to clearly visualize their operating environment and take strategic steps.

MRH functions as an integrated platform for the following products and services: Objective and sound market forecasts, qualitative and quantitative analysis, incisive insight into defining industry trends, and market share estimates. Our reputation lies in delivering value and world-class capabilities to our clients.

Matched content

Editor’s pick