The Global 3D TSV Memory Market Is Expected To Reach A Valuation Of US$ 15 Billion By 2031

Rockville, United States, 2022-Sep-02 — /EPR Network/ —

250 Pages 3D TSV Memory Market Survey by Fact MR, A Leading Business and Competitive Intelligence Provider

ICT companies are extensively adopting technologies such as cloud computing and artificial intelligence to ensure seamless operations as teams continue working from home. Focus on fast automation, use of real-time operation within various end-use sectors such as automotive, food & beverage and others will provide stimulus to the growth.

The report offers actionable and valuable market insights of 3D TSV Memory. The latest report by Fact.MR provides details on the present scenario of the market across various regions along with the historic data and forecast of the market. The report also includes information on the sales and demand of 3D TSV Memory Market across various industries and regions.

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The market study done by Fact.MR gives exclusive information about how the market will grow. The study identifies crucial trends that are determining the growth of 3D TSV Memory market. This newly published report sheds light on vital dynamics, such as the drivers, restraints, and opportunities for key market players as well as emerging players associated with the production and supply. The latest report by Fact.MR provides detailed Market Analysis of 3D TSV Memory

This newly published and insightful report sheds light on Market Insights of 3D TSV Memory, key dynamics, their impact on the overall value chain from suppliers to end-users and Growth of 3D TSV Memory Market.

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The future of the 3D through-silicon-via devices market looks promising with opportunities in consumer electronics, information and communication technology, automotive, military, aerospace, and defense industries.

Key Takeaways from Market Study

• Global 3D through-silicon-via devices market to top US$ 15 Bn by 2031.
• 3D TSV memory projected to reach around US$ 5 Bn by 2031.
• CMOS image sensors projected to record above 18% CAGR over next 10 years.
• Market in Asia Pacific holds share of more than 50%.
• Market in Japan expected to reach valuation of US$ 3 Bn by 2031.
• Market in South Korea to record 16% CAGR over forecast period of 2021- 2031.

“Miniaturization of electronic devices and growing adoption of cloud-based storage are key factors expected to support demand growth of 3D through-silicon-via devices over the coming years,” according to a Fact.MR analyst.

Market Competition

Various prominent players operating in the 3D TSV devices market are focusing on the expansion of their business operations in emerging regions.

• In April 2019, TSMC introduced ANSYS (ANSS) solutions for sophisticated 3D chip stacking technology for its innovative system-on-integrated chips (TSMC-SoIC) in order to enable customers with greater performance and power efficiency for highly complex and demanding cloud and data center applications.
• Top manufacturers of 3D TSV sensors are experiencing cut-throat competition due to rise in the sales of 3D TSV CMOS image sensors across the world and numerous players in this space.
• In October 2019, Samsung developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses TSVs to create high-capacity high bandwidth memory devices for applications, such as higher-end graphics, FPGAs, and compute cards.

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3D TSV Devices Industry Report Scope

Attribute	Details
Market size value in 2020	USD 5 Billion
Market forecast value in 2031	USD 15 Billion
Growth Rate	CAGR of 20% from 2021 to 2031
Forecast Period	2021-2031
Historical Data Available for	2016-2020
Market Analysis	US$ Mn for Value & ‘000 Units for Volume
Key Regions Covered	North AmericaLatin AmericaEuropeEast AsiaSouth AsiaOceaniaMEA
Key Countries Covered	U.S.CanadaGermanyU.K.FranceSpainItalyRussiaChinaJapanSouth KoreaIndiaAustraliaBrazilMexicoArgentinaGCCSouth Africa
Key Market Segments Covered	ProductProcess RealizationApplicationRegion
Key Companies Profiled	Amkor Technology, Inc.Broadcom Ltd.Pure Storage, Inc.STATS ChipPAC Ltd.SK Hynix Inc.Invensas CorporationSamsung Electronics Co., Ltd.ASE Technology Holding, Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)United Microelectronics CorporationSony CorporationTeledyne DALSA Inc.Xilinx Inc.Intel Corporation
Pricing	Available upon Request

Key Segments in 3D TSV Devices Industry Research

• Product
  • 3D TSV Memory
  • 3D TSV Advanced LED Packaging
  • 3D TSV CMOS Image Sensors
  • 3D TSV Imaging and Opto-Electronics
  • 3D TSV MEMS
• Process Realization
  • 3D TSV Devices Via First Process Realization
  • 3D TSV Devices Via Middle Process Realization
  • 3D TSV Devices Via Last Process Realization
• Application
  • Use of 3D TSV Devices in Consumer Electronics
    • Use of 3D TSV Devices in Mobile Devices
    • Use of 3D TSV Devices in Processors in Computers and Laptops
  • Use of 3D TSV Devices in Automotive Sector
    • Use of 3D TSV Devices in Automotive Sensors
    • Use of 3D TSV Devices in Automotive Body Electronics
  • Use of 3D TSV Devices in IT and Telecom
    • Use of 3D TSV Devices in Communications
    • Use of 3D TSV Devices in Information Technology & Networking
  • Use of 3D TSV Devices in Healthcare Sector
  • Use of 3D TSV Devices in Military, Aerospace & Defense Sector

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• Growth of 3D TSV Memory Market
• Market Analysis of 3D TSV Memory
• Market Insights of 3D TSV Memory
• Key Drivers Impacting the 3D TSV Memory market
• Which are the Key drivers impacted by 3D TSV Memory market
• Restraints 3D TSV Memory Market Growth
• Market Survey of 3D TSV Memory

More Valuable Insights on 3D TSV Memory Market

Fact.MR, in its new report, offers an unbiased Market Analysis of 3D TSV Memory, Sales and Demand of 3D TSV Memory, analyzing forecast statistics through 2019 and beyond. The study reveals growth projections on the basis of various criteria.

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