3D Semiconductor Packaging Market is Expected to Growing with a CAGR of 16.8% during 2019-2025

Albany, US, 2019-Oct-03 — /EPR Network/ —The global market status for 3D Semiconductor Packaging Market is precisely examined through a smart research report added to the broad database managed by Market Research Hub (MRH). This study is titled “Global 3D Semiconductor Packaging Market Size, Status and Forecast 2019-2025”, which tends to deliver in-depth knowledge associated to the 3D Semiconductor Packaging Market for the present and forecasted period until 2025. Furthermore, the report examines the target market based on market size, revenue and geography; making it quite useful for the readers.

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3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip chip to achieve vertical stacks. Examples of 3D packages include package-on-package (PoP) where individual die are packaged, and the packages are stacked and interconnected with wire bonds or flip chip processes; and 3D wafer-level packaging (3D WLP) that uses redistribution layers (RDL) and bumping processes to form interconnects.

Consumer Electronics industry contributed over 54% of the overall 3D semiconductor packaging market in 2018. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 17.82% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide.

In 2018, the global 3D Semiconductor Packaging market size was 1751.8 million US$ and it is expected to reach 5266.4 million US$ by the end of 2025, with a CAGR of 16.8% during 2019-2025.

This report focuses on the global 3D Semiconductor Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the 3D Semiconductor Packaging development in United States, Europe, China, Taiwan, Korea and Japan.

The key players covered in this study
SK Hynix
China Wafer Level CSP
Interconnect Systems

Market segment by Type, the product can be split into
3D Wire Bonding
3D Fan Out

3D Wire Bonding Occupy the largest market share segment reached 44%

Market segment by Application, split into
Consumer Electronics
Automotive & Transport
IT & Telecommunication

Consumer Electronics has the largest market share segment with 54% and the fastest growth

Market segment by Regions/Countries, this report covers
United States


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Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global 3D Semiconductor Packaging Market Size Growth Rate by Type (2014-2025)
1.4.2 3D Wire Bonding
1.4.3 3D TSV
1.4.4 3D Fan Out
1.4.5 Others
1.5 Market by Application
1.5.1 Global 3D Semiconductor Packaging Market Share by Application (2019-2025)
1.5.2 Consumer Electronics
1.5.3 Industrial
1.5.4 Automotive & Transport
1.5.5 IT & Telecommunication
1.5.6 Others
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 3D Semiconductor Packaging Market Size
2.2 3D Semiconductor Packaging Growth Trends by Regions
2.2.1 3D Semiconductor Packaging Market Size by Regions (2019-2025)
2.2.2 3D Semiconductor Packaging Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Challenges
2.3.4 Porters Five Forces Analysis

3 Market Share by Key Players
3.1 3D Semiconductor Packaging Market Size by by Players
3.1.1 Global 3D Semiconductor Packaging Revenue by by Players (2014-2019)
3.1.2 Global 3D Semiconductor Packaging Revenue Market Share by by Players (2014-2019)
3.1.3 Global 3D Semiconductor Packaging Market Concentration Ratio (CR5 and HHI)
3.2 3D Semiconductor Packaging Key Players Head office and Area Served
3.3 Key Players 3D Semiconductor Packaging Product/Solution/Service
3.4 Date of Enter into 3D Semiconductor Packaging Market
3.5 Mergers & Acquisitions, Expansion Plans

Continued…………. #@

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