Extreme Ultraviolet (EUV) Lithography Market Shaping to Reach USD 36.8 Billion by 2030 with 21.7% CAGR

Richmond, United States, 2024-Apr-12 — /EPR Network/ —

In 2023, the Extreme Ultraviolet (EUV) Lithography Market reached a valuation of USD 9.3 Billion. Projections suggest a significant increase to USD 36.8 Billion by 2030, reflecting a robust compound annual growth rate (CAGR) of 21.7% during the forecast period spanning from 2023 to 2030.

The Extreme Ultraviolet (EUV) Lithography Market represents a groundbreaking advancement in semiconductor manufacturing, offering unparalleled precision and scalability for the production of next-generation integrated circuits (ICs). By harnessing ultraviolet light at extremely short wavelengths, EUV lithography enables the fabrication of nanoscale features with exceptional accuracy and efficiency. In this blog, we delve into the significance, innovations, and market dynamics of the EUV Lithography Market, shedding light on its transformative impact on the semiconductor industry.

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Major Vendors in the Global Extreme Ultraviolet (EUV) Lithography Market:

  • ASML
  • Carl Zeiss AG
  • TOPPAN Inc.
  • NTT Advanced Technology Corporation
  • KLA Corporation
  • Ushio Inc.
  • SUSS MicroTec SE
  • AGC Inc.
  • Lasertec Corporation
  • NuFlare Technology
  • Energetiq Technology Inc.
  • Photronics, Inc.
  • HOYA Corporation
  • Rigaku Corporation
  • Edmund Optics Ltd.
  • Park Systems
  • Zygo Corporation
  • Imagine Optic
  • Applied Materials, Inc.

Key Trends and Innovations:

  • Nanoscale Precision: EUV lithography enables the creation of semiconductor devices with nanoscale features, such as transistors, interconnects, and memory cells, with dimensions below 10 nanometers (nm). This unprecedented level of precision is essential for advancing Moore’s Law and meeting the performance demands of next-generation electronics.
  • Yield Improvement: EUV lithography offers superior imaging capabilities and reduced process complexity compared to traditional optical lithography techniques. As a result, semiconductor manufacturers can achieve higher yields and lower defect densities, leading to increased production efficiency and cost-effectiveness in IC fabrication.
  • Advanced Light Source Technology: The development of high-power EUV light sources, such as laser-produced plasma (LPP) and discharge-produced plasma (DPP) sources, has been a key driver of innovation in the EUV Lithography Market. These light sources generate intense EUV radiation required for lithographic patterning, enabling high-throughput manufacturing of advanced semiconductor devices.
  • Integration in Semiconductor Nodes: EUV lithography is increasingly integrated into leading-edge semiconductor fabrication processes, including 7nm, 5nm, and beyond. As semiconductor nodes continue to shrink and device complexity increases, EUV lithography becomes indispensable for achieving the required feature density and device performance.

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Major Segmentations Are Distributed as follows:

  • By Equipment:
    • Mask
    • Light Source
    • Optics
    • Others
  • By Light Source:
    • Laser Produced Plasmas (LPP)
    • Vacuum Sparks
    • Gas Discharges
  • By End Use:
    • Integrated Device Manufacturer (IDM)
    • Foundry
    • Memory
  • By Region
    • North America
      • U.S.
      • Canada
    • Latin America
      • Brazil
      • Mexico
      • Argentina
      • Colombia
      • Chile
      • Peru
      • Rest of Latin America
    • Europe
      • Germany
      • France
      • Italy
      • Spain
      • U.K.
      • BENELUX
      • CIS & Russia
      • Nordics
      • Austria
      • Poland
      • Rest of Europe
    • Asia Pacific
    • China
    • Japan
    • South Korea
    • India
    • Thailand
    • Indonesia
    • Malaysia
    • Vietnam
    • Australia & New Zealand
    • Rest of Asia Pacific
    • Middle East & Africa
    • Saudi Arabia
    • UAE
    • South Africa
    • Nigeria
    • Egypt
    • Israel
    • Turkey
    • Rest of MEA

 Recent Developments

  • In March 2021, Samsung is ramping up production of EUV scanners capable of competing with the world’s largest foundry, TSMC. EUV scanners, as opposed to traditional machines, optimize the chip fabrication process by decreasing the number of photolithography procedures required to build finer circuits, forcing major chipmakers to compete for the technology.
  • In January 2022, ASML announced the last phase of collaboration with Intel Corporation to drive High- NA into manufacturing in 2025. The main objective is to advance the cutting edge of semiconductor lithography technology. The first purchase order issued by Intel Corporation to ASML for the delivery of the industry’s first TWINSCAN EXE: 5200 system – an extreme ultraviolet (EUV) high-volume production system with a more than 200 wafers per hour productivity and huge numerical aperture and – as part of their long-term High-NA collaboration framework.

Market Dynamics and Opportunities:

The EUV Lithography Market is propelled by the growing demand for advanced semiconductor technologies, including smartphones, tablets, data centers, artificial intelligence (AI), and Internet of Things (IoT) devices. Opportunities for market growth include expanding adoption in foundries and integrated device manufacturers (IDMs), continuous improvements in EUV tool performance and throughput, and R&D investments to address technical challenges and scale EUV technology to higher-volume production.

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In conclusion, the EUV Lithography Market represents a pivotal advancement in semiconductor manufacturing, enabling the production of cutting-edge ICs with unprecedented precision and efficiency. By harnessing the power of extreme ultraviolet light, semiconductor manufacturers can push the boundaries of device miniaturization and performance, driving innovation across a wide range of industries. As the semiconductor industry continues to evolve, the EUV Lithography Market remains at the forefront of technological progress, shaping the future of electronics and digital innovation.

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