SiC Wafer Polishing Market to Hit USD 0.63 Billion by 2030 with a 38.0% CAGR

Posted on 2024-04-10 by MarketDigits in Chemicals // 0 Comments

Richmond, United States, 2024-Apr-10 — /EPR Network/ —

The SiC Wafer Polishing Market, was valued at USD 0.4 Billion and is expected to reach USD 0.63 Billion by 2030. This growth corresponds to a notable compound annual growth rate (CAGR) of 38.0% during the forecast period from 2023 to 2030.

Silicon Carbide (SiC) wafers play a critical role in the semiconductor industry, offering superior performance and efficiency compared to traditional silicon wafers. As the demand for SiC-based devices continues to rise across various applications such as power electronics, automotive, aerospace, and telecommunications, the SiC Wafer Polishing Market is witnessing significant growth. In this blog, we will explore the dynamics, trends, innovations, and growth prospects in the SiC wafer polishing market.

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Major Players In SiC Wafer Polishing Market Include:

3M
Ace Nanochem Co., Ltd.
Advanced Abrasives Corporation
AGC Inc.
Allied High Tech Products
DuPont Incorporated
Engis Corporation
Entegris
Ferro Corporation
Fujibo Holdings, Inc.
Fujifilm Holdings America Corporation
Fujimi Incorporated
Iljin Diamond Co., Ltd.
JSR Corporation
Kemet International Limited
Lapmaster Wolters
Logitech Ltd.
Nitta DuPont Incorporated
Pureon
Saint-Gobain
Others

Understanding SiC Wafer Polishing

SiC wafers are essential substrates used in the fabrication of semiconductor devices such as power diodes, MOSFETs, and RF transistors. The polishing process is a critical step in the manufacturing of SiC wafers, as it determines the surface quality, flatness, and overall performance of the final semiconductor devices. SiC wafer polishing involves precision grinding, lapping, and chemical-mechanical polishing (CMP) techniques to achieve the desired surface finish and thickness uniformity.

Market Dynamics

Rapid Growth in SiC Device Market: The increasing adoption of SiC-based devices in power electronics, electric vehicles, renewable energy systems, and 5G infrastructure is driving the demand for high-quality SiC wafers. This surge in demand is fueling growth in the SiC wafer polishing market.
Technological Advancements: Advancements in polishing technologies, abrasive materials, and polishing slurries are enhancing the efficiency, precision, and quality of SiC wafer polishing processes. Innovations such as advanced CMP slurries, diamond-based polishing pads, and in-situ monitoring systems are optimizing polishing performance and reducing production costs.
Growing Investment in R&D: Leading manufacturers and research institutions are investing in research and development to develop next-generation SiC wafer polishing solutions. Collaborative efforts are focused on improving surface roughness, reducing defect densities, and enhancing wafer flatness to meet the stringent requirements of SiC-based device fabrication.
Increasing Demand for 150mm and 200mm Wafers: The transition from 100mm to larger diameter wafers (150mm and 200mm) is gaining traction in the SiC wafer market, driven by the scalability, cost-effectiveness, and performance benefits offered by larger wafer sizes. As a result, there is a growing demand for advanced polishing technologies capable of processing larger diameter SiC wafers with high precision and yield.

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Market Trends and Innovations

Transition to Single-Wafer Processing: The shift towards single-wafer processing techniques, such as CMP, is gaining momentum in the SiC wafer polishing market. Single-wafer processing offers advantages such as improved process control, reduced material consumption, and enhanced uniformity compared to batch processing methods.
Development of Next-Generation Polishing Slurries: Manufacturers are developing advanced polishing slurries tailored for SiC wafer polishing applications. These next-generation slurries feature optimized particle size distributions, chemical compositions, and rheological properties to achieve superior surface finish, planarity, and defect reduction.
Integration of Automation and AI: Automation and artificial intelligence (AI) are being increasingly integrated into SiC wafer polishing systems to enhance process control, productivity, and quality consistency. Automated polishing systems equipped with real-time monitoring and control capabilities enable rapid adjustment of process parameters to optimize polishing performance and yield.

Major Segmentations Are Distributed as follows:

By Type of SiC Wafer
- 4H-SiC
- 6H-SiC
By Product Type
- Abrasive powders
- Polishing pads
- Diamond slurries
- Colloidal silica suspensions
- Others
By Process Type
- Mechanical polishing
- Chemical-mechanical polishing (CMP)
- Electropolishing
- Chemical polishing
- Others
By Application
- Power Electronics
- Light-emitting diodes (LEDs)
- Sensors & detectors
- Rf & microwave devices
- Others
By End-use Vertical
- Electronics & Semiconductors
- Automotive
- Aerospace & Defense
- Energy & Power
- Others
By Region
- North America
  - US
  - Canada
- Latin America
  - Brazil
  - Mexico
  - Argentina
  - Colombia
  - Chile
  - Peru
  - Rest of Latin America
- Europe
  - Germany
  - France
  - Italy
  - Spain
  - U.K.
  - BENELUX
  - CIS & Russia
  - Nordics
  - Austria
  - Poland
  - Rest of Europe
- Asia Pacific
  - China
  - Japan
  - South Korea
  - India
  - Thailand
  - Indonesia
  - Malaysia
  - Vietnam
  - Australia & New Zealand
  - Rest of Asia Pacific
- Middle East & Africa
  - Saudi Arabia
  - UAE
  - South Africa
  - Nigeria
  - Egypt
  - Israel
  - Turkey
  - Rest of MEA

Recent Developments

In October 2023, Wolfspeed announced a new 6-inch SiC wafer polishing facility in Durham, North Carolina. The facility is expected to be operational in 2024 and will double Wolfspeed’s SiC wafer polishing capacity.
In September 2023, SiCrystal announced a partnership with Cabot Microelectronics to develop new polishing slurries for SiC wafers. The slurries are expected to improve the surface quality and defect density of SiC wafers.

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Conclusion

In conclusion, the SiC Wafer Polishing Market is witnessing robust growth fueled by the escalating demand for SiC-based devices and advancements in polishing technologies. As industry players focus on innovation, quality improvement, and scalability, the market is poised to capitalize on emerging opportunities in various sectors. With the increasing adoption of SiC wafers in critical applications such as power electronics, automotive, and telecommunications, the SiC wafer polishing market is set to play a pivotal role in enabling the next generation of semiconductor devices and technologies.

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